Tin Solder powder
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| Payment Terms: | L/C,T/T |
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Detailed Product Description
Alloy | SnAg3.0Cu0.5 | SnAg3.8Cu0.7 | Sn99.3Cu0.7 | Sn96.5Ag3.5 | Sn95Sb5 |
Melting point, | 217-219 | 217(Eutectic) | 227(Eutectic) | 221(Eutectic) | 235-240 |
Flux content,% | 3.0±0.5 | 3.0±0.5 | 3.0±0.5 | 3.0±0.5 | 3.0±0.5 |
Diameter, | 0.5~2.0 | 0.5~2.0 | 0.5~2.0 | 0.5~2.0 | 0.5~2.0 |
Core | Single, triple | Single, triple | Single, triple | Single, triple | Single, triple |
Application | Lead-free alloy in standard electronic application | Lead-free alloy in standard lectronic application | Electronic application in consumable | Application in electronic and project domain | Application in low lost project domain |
Tin Solder powder
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Company Info
Jinhua Beiduo Import & Export Co., Ltd.
[China (Mainland)]
[Verified Member]
City: Jinhua
Province/State: Zhejiang
Country/Region : China (Mainland)
Business Type:Manufacturer, Trading Company, Agent
Online Postings: Products